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RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 1
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 1

RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools

by RELIFE
$990.00




    Delivered in 10-15 Days.
    more info Orders from overseas warehouse are delivered to our customers within 10-15 working days. We have a dedicated team to keep things moving quickly, and we will keep you updated on your order via SMS or email.
    All-Inclusive Pricing.
    more info The price you see is the price you pay. Price includes any Customs, Insurance and Courier fees. Absolutely no hidden fees. We also take care of customs clearance.
    Hassle-Free returns For 7 Days.
    more info View our Return Policy for more info.
  • Support Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series. Applicable to ACU/EMMC/EXC/HIC/MTC/SMC series, etc.
  • Use mobile phones for actual measurement to ensure accuracy. Each mesh is calibrated according tothe mobile phone drawings to ensure that every solder joint is indispensable
  • It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
  • UItra thin design, better fit of tin planting, continuous bending and full toughness

Specifications:

  • Product: Android series chip planting tin steel stencil set
  • Model: RL-044
  • Net weight: about 130g
  • Size: 50 * 50 * 0.12/0.15mm
  • Thickness: 0.12 /0.15mm (EMMC series)
  • Quantity: 58pcs/box

In the box

  • 4 x ACU
  • 6 x EMMC
  • 9 x HIC
  • 11 x MTC
  • 21 x SMC
  • 7 x EXC
  • Other items not included