- 【Strong Magnetic Adsorption】Powerful magnetic system ensures precise chip positioning and prevents movement during the tin plating process for reliable BGA repair operations.
- 【One-Step Maintenance】Streamlined design enables quick and easy chip installation and maintenance without complex fixture adjustments, simply close to complete chip securing.
- 【Universal Chip Compatibility】Supports multiple series including IP, Hisilicon, Qualcomm chips and general BGA packaged CPUs for versatile repair applications.
- 【Precision Steel Mesh Positioning】Yellow steel mesh layer ensures accurate alignment with chip pins for high-precision tin plating operations and consistent results.
- 【Ergonomic Design】Symmetrical groove structure in the blue housing provides comfortable grip and handling during repair work.
- 【Environmental Protection Materials】Constructed with non-toxic, wear-resistant, high-temperature resistant and anti-aging materials for safe and durable performance.
In the box
- 1 x Tin Plating Platform
