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JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 1
JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 2
JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 3
JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 4
JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 5
JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 6
JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183° - 7
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JITONGXUE Anti Oxidation Solder Paste 50G For Phone Repair BGA SMT Electronic Components Soldering - 183°

R440
incl. VAT
Dispatches in 1 – 3 days
Color 183°

Same price across all color options · selecting one updates the gallery

Compatible with 2 devices

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Universal · 2

  • Universal Models
  • Universal
Nationwide delivery
2–4 working days to major metros
Secure checkout
Card, EFT, Ozow and PayFast
30-day returns
Unused, in original packaging
Description
  • 【High-Quality Antioxidant Formula】Advanced no-clean solder paste with superior antioxidant properties ensures longer shelf life and maintains excellent performance during storage.
  • 【Three Temperature Options】Available in 138°C, 158°C, and 183°C melting points to accommodate different components and applications, from low-temperature soldering to high-precision chip work.
  • 【Uniform Fine Tin Beads】Features evenly distributed, fine tin beads with moderate viscosity that prevent component shifting and ensure consistent, void-free solder joints.
  • 【No Residue Clean Joints】Lead-free formula with rosin flux activator creates strong, shiny solder joints with no residue, eliminating the need for post-soldering cleaning.
  • 【Excellent Wettability】Superior wetting properties ensure full joint coverage and strong adhesion, preventing cold joints and providing reliable connections.
  • 【Professional Grade Performance】Specifically designed for precision electronic repair and assembly, delivering consistent results for mobile repair, BGA rework, and SMT applications.

Specifications:

  • Weight: 50g per container
  • Applications: Mobile repair, BGA chip rework, SMT assembly, LED soldering, wire connections
  • 183℃ application: CPU/ chip/hard disk/tail plug, etc.
  • 158℃ application: tin plating in the middle layer of double-layer motherboard, etc.
  • 138℃ application: changing tin and dragging tin, low temperature welding, etc.

In the box

  • 1 x High-Quality Anti-Oxidation Solder Paste 50G
Specifications
SKU
6616001701A
Package dimensions
6 × 4 × 4 cm
Gross weight
0.06 kg
Units per pack
290
Dispatch
1 - 3 days
Category
Cell Phone Parts › Soldering Tools & Accessories › Solder Balls & Pastes
What’s in the box 1 item
  • 1 High-Quality Anti-Oxidation Solder Paste 50G
Shipping & returns South Africa
Dispatch
Orders placed before 13:00 are picked the same day. Dispatch time for each item is shown next to the price.
Delivery
Courier to your door: 2–4 working days to Gauteng, Cape Town and Durban; 3–6 days to outlying areas.
Returns
30 days from delivery for unused goods in original packaging. Faulty items are replaced or refunded in full.
Warranty
12-month warranty against manufacturing defects, handled locally — no cross-border shipping required.
R440
1 - 3 days

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