With over 10,000 orders
With over 10,000 orders
【Professional BGA Reballing Stencil】High-precision solder reballing stencil designed specifically for BGA chip repair and tin ball replacement in professional electronics repair.
【Premium Stainless Steel】Made from high-grade stainless steel with tin plating surface treatment for superior durability and precision.
【Ultra-Thin 0.12mm Design】Precision die-casting technology creates ultra-thin 0.12mm thickness with high toughness, ensuring no warping or deformation during use.
【700℃ High Temperature Resistant】Withstands extreme temperatures up to 700℃ without thermal deformation, perfect for professional soldering applications.
【Easy Release & Full Solder Joints】Non-stick surface ensures easy removal from PCB boards without leaving empty solder points, achieving full and precise solder ball placement.
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