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BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 1
BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 2
BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 3
BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 4
BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 5
BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 6
BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series - 7
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BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series

Colour As Shown
R560
incl. VAT
Dispatches in 1 – 3 days
Nationwide delivery
2–4 working days to major metros
Secure checkout
Card, EFT, Ozow and PayFast
30-day returns
Unused, in original packaging
Description
  • 【Professional BGA Reballing Stencil】High-precision solder reballing stencil designed specifically for BGA chip repair and tin ball replacement in professional electronics repair.

  • 【Premium Stainless Steel】Made from high-grade stainless steel with tin plating surface treatment for superior durability and precision.

  • 【Ultra-Thin 0.12mm Design】Precision die-casting technology creates ultra-thin 0.12mm thickness with high toughness, ensuring no warping or deformation during use.

  • 【700℃ High Temperature Resistant】Withstands extreme temperatures up to 700℃ without thermal deformation, perfect for professional soldering applications.

  • 【Easy Release & Full Solder Joints】Non-stick surface ensures easy removal from PCB boards without leaving empty solder points, achieving full and precise solder ball placement.

Specifications:

  • Material: Stainless Steel
  • Surface Treatment: Tin Plating
  • Thickness: 0.12mm
  • Dimensions: 100mm x 80mm
  • Temperature Resistance: Up to 700℃
  • Chip Models: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17

In the box

  • 10 x BGA IC Solder Reballing Stencils
Specifications
SKU
6616001920A
Colour
As Shown
Package dimensions
12 × 8.8 × 0.5 cm
Gross weight
0.08 kg
Units per pack
210
Dispatch
1 - 3 days
Category
Cell Phone Parts › Repair Tools › BGA Stencils
What’s in the box 1 item
  • 10 BGA IC Solder Reballing Stencils
Shipping & returns South Africa
Dispatch
Orders placed before 13:00 are picked the same day. Dispatch time for each item is shown next to the price.
Delivery
Courier to your door: 2–4 working days to Gauteng, Cape Town and Durban; 3–6 days to outlying areas.
Returns
30 days from delivery for unused goods in original packaging. Faulty items are replaced or refunded in full.
Warranty
12-month warranty against manufacturing defects, handled locally — no cross-border shipping required.
R560
1 - 3 days

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