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BEST BST-082 For iPhone 13 Series CPU Soldering Reballing Stencil Cell Phone Magnetic Tinning Plate
R570
incl. VAT
Dispatches in 1 – 3 days
Compatible with 2 devices
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2 devices
Universal · 2
- Universal Models
- Universal
No match in this product's fitment list. It may still work — contact us with your model.
Nationwide delivery
2–4 working days to major metros
Secure checkout
Card, EFT, Ozow and PayFast
30-day returns
Unused, in original packaging
Description
- There is a strong magnet embedded in the base, and strong magnetic adsorption, so that the positioning is accurate, does not deviate, and the magnetism does not change at high temperatures
- High temperature resistant, not easy to deform, non-sticky, easy to get off the net
- Every tin dot is as full as a pearl. Suitable for iPhone 13 series motherboard mid-layer repair
- Strong magnetic adsorption for a tight fit. With precise positioning alignment holes for more convenience
- CNC high-precision integrated processing, stencil and pad precision alignment stable positioning scraping tin ball implantation without deviation
In the box
- 1 x Set of CPU Soldering Reballing Stencil
Specifications
- SKU
- 661600826A
- Colour
- As Shown
- Package dimensions
- 11 × 9 × 1 cm
- Gross weight
- 0.07 kg
- Units per pack
- 338
- Dispatch
- 1 - 3 days
- Category
- Cell Phone Parts › Repair Tools › BGA Stencils
What’s in the box
- 1 Set of CPU Soldering Reballing Stencil
Shipping & returns
Dispatch
Orders placed before 13:00 are picked the same day. Dispatch time for each item is shown next to the price.
Delivery
Courier to your door: 2–4 working days to Gauteng, Cape Town and Durban; 3–6 days to outlying areas.
Returns
30 days from delivery for unused goods in original packaging. Faulty items are replaced or refunded in full.
Warranty
12-month warranty against manufacturing defects, handled locally — no cross-border shipping required.
R570
1 - 3 days