Certified Business
With over 10,000 orders
With over 10,000 orders
AMAOE BGA Chip Rework Reballing Stencil Magnetic Positioning Tin Pad for iPhone / Android Phone Repair
R210
incl. VAT
Dispatches in 1 – 3 days
Compatible with 2 devices
Set your device and we will check it for you.
2 devices
Universal · 2
- Universal Models
- Universal
No match in this product's fitment list. It may still work — contact us with your model.
Nationwide delivery
2–4 working days to major metros
Secure checkout
Card, EFT, Ozow and PayFast
30-day returns
Unused, in original packaging
Description
- 【Magnetic Positioning】Steel mesh magnetic leveling system frees up both hands for efficient operation
- 【Versatile Application】Suitable for repairing tin pads on BGA chips in both iOS and Android smartphones
- 【Enhanced Stability】Designed to prevent movement during tin scraping, ensuring more uniform results
- 【Precision Repair】Facilitates accurate and controlled tin pad repair for delicate electronic components
- 【User-Friendly Design】Easy-to-use tool optimized for mobile device repair technicians and enthusiasts
In the box
- 1 x Repair Tin Pad
Specifications
- SKU
- 6616001408A
- Colour
- As Shown
- Package dimensions
- 10 × 8 × 1 cm
- Gross weight
- 0.02 kg
- Units per pack
- 952
- Dispatch
- 1 - 3 days
- Category
- Cell Phone Parts › Soldering Tools & Accessories › Other Soldering Tools
What’s in the box
- 1 Repair Tin Pad
Shipping & returns
Dispatch
Orders placed before 13:00 are picked the same day. Dispatch time for each item is shown next to the price.
Delivery
Courier to your door: 2–4 working days to Gauteng, Cape Town and Durban; 3–6 days to outlying areas.
Returns
30 days from delivery for unused goods in original packaging. Faulty items are replaced or refunded in full.
Warranty
12-month warranty against manufacturing defects, handled locally — no cross-border shipping required.
R210
1 - 3 days