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1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm

by TVCMall
$190.00





    Delivered in 10-15 Days.
    more info Orders from overseas warehouse are delivered to our customers within 10-15 working days. We have a dedicated team to keep things moving quickly, and we will keep you updated on your order via SMS or email.
    All-Inclusive Pricing.
    more info The price you see is the price you pay. Price includes any Customs, Insurance and Courier fees. Absolutely no hidden fees. We also take care of customs clearance.
    Hassle-Free returns For 7 Days.
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  • Brand new and high quality

  • Solder tin paste is the best choice of reballing IC 

  • It is used instead of the pin in the IC component package structure

Specification:

  • Brand: BEST

  • Model: 505

  • Material: tin

  • Diameter: 0.2mm~0.65mm 

  • Flux content: 63%

  • Melting point: 183°C

  • Working temperature: 200-380°C

  • Quantity: 25,000pcs per bottle

  • Balls alloy: Sn63/Pb37

  • Size: 35x16mm

In the box

  • 1 x 1 Bottle Tin BGA Reballing Soldering Balls