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BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 1
BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 2
BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 3
BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 4
BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 5
BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 6
BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools - 7
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BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools

Colour As Shown
R550
incl. VAT
Dispatches in 1 – 3 days
Nationwide delivery
2–4 working days to major metros
Secure checkout
Card, EFT, Ozow and PayFast
30-day returns
Unused, in original packaging
Description
  • 【High-Precision BGA Reballing Stencils】Professional-grade stencils specifically designed for Samsung series chip reballing with precise hole placement and snug fit for accurate solder ball positioning.

  • 【Premium Steel Construction】Made from high-quality Japanese stainless steel with 700℃ high-temperature resistance, ensuring durability and long service life without deformation.

  • 【Ultra-Thin 0.12mm Design】Precision die-cast construction with 0.12mm thickness provides flexibility while maintaining structural integrity for professional IC repair work.

  • 【Non-Stick Tin Plating Surface】Special tin plating treatment prevents solder adhesion and enables easy removal from circuit boards without leaving cold joints or bridges.

  • 【Professional Reballing Solution】Engineered for IC chip repair and rework processes, delivering high yield rates and full solder joints when properly aligned.

Specifications:

  • Material: Stainless Steel
  • Surface Treatment: Tin Plating
  • Thickness: 0.12mm
  • Temperature Resistance: Up to 700℃
  • Stencil Dimensions: 100mm x 80mm
  • Manufacturing Process: Precision Die Casting

In the box

  • 10 x BGA IC Solder Reballing Stencils
Specifications
SKU
6616001915A
Colour
As Shown
Package dimensions
12 × 8.8 × 0.5 cm
Gross weight
0.08 kg
Units per pack
210
Dispatch
1 - 3 days
Category
Cell Phone Parts › Repair Tools › BGA Stencils
What’s in the box 1 item
  • 10 BGA IC Solder Reballing Stencils
Shipping & returns South Africa
Dispatch
Orders placed before 13:00 are picked the same day. Dispatch time for each item is shown next to the price.
Delivery
Courier to your door: 2–4 working days to Gauteng, Cape Town and Durban; 3–6 days to outlying areas.
Returns
30 days from delivery for unused goods in original packaging. Faulty items are replaced or refunded in full.
Warranty
12-month warranty against manufacturing defects, handled locally — no cross-border shipping required.
R550
1 - 3 days

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