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1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm
R190
incl. VAT
Dispatches in 1 – 3 days
Color
Diameter: 0.2mm
Same price across all color options · selecting one updates the gallery
Compatible with 2 devices
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2 devices
Universal · 2
- Universal Models
- Universal
No match in this product's fitment list. It may still work — contact us with your model.
Nationwide delivery
2–4 working days to major metros
Secure checkout
Card, EFT, Ozow and PayFast
30-day returns
Unused, in original packaging
Description
Brand new and high quality
Solder tin paste is the best choice of reballing IC
It is used instead of the pin in the IC component package structure
Specification:
Brand: BEST
Model: 505
Material: tin
Diameter: 0.2mm~0.65mm
Flux content: 63%
Melting point: 183°C
Working temperature: 200-380°C
Quantity: 25,000pcs per bottle
Balls alloy: Sn63/Pb37
Size: 35x16mm
In the box
- 1 x 1 Bottle Tin BGA Reballing Soldering Balls
Specifications
- SKU
- 231401329B
- Package dimensions
- 3.5 × 1.6 × 1.6 cm
- Gross weight
- 0.02 kg
- Units per pack
- 1060
- Dispatch
- 1 - 3 days
- Category
- Cell Phone Parts › Soldering Tools & Accessories › Solder Balls & Pastes
What’s in the box
- 1 1 Bottle Tin BGA Reballing Soldering Balls
Shipping & returns
Dispatch
Orders placed before 13:00 are picked the same day. Dispatch time for each item is shown next to the price.
Delivery
Courier to your door: 2–4 working days to Gauteng, Cape Town and Durban; 3–6 days to outlying areas.
Returns
30 days from delivery for unused goods in original packaging. Faulty items are replaced or refunded in full.
Warranty
12-month warranty against manufacturing defects, handled locally — no cross-border shipping required.
R190
1 - 3 days