{"title":"BGA Stencils","description":"\u003cp\u003eCell Phone Parts \u0026gt; Repair Tools \u0026gt; BGA Stencils\u003c\/p\u003e","products":[{"product_id":"relife-rl-601t-31-in-1-fixture-set-for-iphone-x-17-series-middle-layer-board-plant-tin-platform-3d-bga-reballing-stencil-kit-6616001193a","title":"RELIFE RL-601T 31 in 1 Fixture Set For iPhone X - 17 Series Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e【Versatile 31-in-1 Set】The RELIFE RL-601T middle layer tin planting platform kit offers a comprehensive solution for iPhone X to iPhone 17 Series\u003c\/li\u003e\n\u003cli\u003e【Super Strong Magnetic Force】Equipped with powerful magnets, this platform ensures secure and stable positioning during tin planting operations\u003c\/li\u003e\n\u003cli\u003e【Expandable Base】Features multiple models of unlimited expansion base, allowing for flexibility and adaptability in different working scenarios\u003c\/li\u003e\n\u003cli\u003e【Precise Positioning】Built-in precise positioning system makes it easier to align holes, ensuring accuracy in tin planting processes\u003c\/li\u003e\n\u003cli\u003e【Tight Fit Design】The platform is engineered to provide a tight and secure fit, enhancing stability during use\u003c\/li\u003e\n\u003cli\u003e【Real Machine Tested】Undergoes thorough real machine testing to guarantee precision and reliability in practical applications\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecifications:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eModel: RL-601T\u003c\/li\u003e\n\u003cli\u003eCompatibility: For iPhone X-17 Series and other models\u003c\/li\u003e\n\u003cli\u003eSet Components: 31-in-1 middle layer tin planting platform kit\u003c\/li\u003e\n\u003cli\u003eKey Features: Super strong magnetic force, expandable base, precise positioning\u003c\/li\u003e\n\u003cli\u003eWeight: about 423g\u003c\/li\u003e\n\u003cli\u003eSize: 105*65*12mm\/160*60*10mm\u003c\/li\u003e\n\u003cli\u003eSteel Mesh Thickness: 0.12mm\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e1 x Base\u003c\/li\u003e\n\u003cli\u003e6 x Module Fixture\u003c\/li\u003e\n\u003cli\u003e19 x Steel Mesh\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"RELIFE","offers":[{"title":"Default Title","offer_id":40886177497263,"sku":"6616001193A","price":1910.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001193A-1.webp?v=1785677464"},{"product_id":"2uul-bh17-cpu-reball-base-magnetic-dual-sided-bga-reballing-platform-set-6616001639a","title":"2UUL BH17 CPU Reball Base Magnetic Dual-Sided BGA Reballing Platform Set","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e【Dual-sided Efficiency】The BH17 features a practical double-sided design, allowing technicians to switch between different types of BGA chips without changing platforms. This is particularly suitable for high-efficiency batch repair environments, maximizing productivity.\u003c\/li\u003e\n\u003cli\u003e【Magnetic Stability】Built-in strong magnets firmly secure CPU\/BGA chips, preventing displacement during solder paste application and hot air reflow. This ensures perfect chip alignment and reduces solder bridges and defects.\u003c\/li\u003e\n\u003cli\u003e【Specialized Design】Specifically designed for CPU and various BGA IC packages, offering precise stencil alignment and uniform solder ball positioning. It's an ideal choice for professional motherboard and smartphone repairs.\u003c\/li\u003e\n\u003cli\u003e【High-precision Manufacturing】The platform is CNC machined with precision, ensuring a tight fit between the stencil and chip surface. This guarantees consistently high-quality reballing results for demanding technicians.\u003c\/li\u003e\n\u003cli\u003e【Heat-resistant Durability】Made from materials designed to withstand high-temperature reflow soldering environments, the BH17 maintains stability even under high heat. Its durability meets the needs of professional repair labs for long-term, repeated use.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecifications:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eModel: BH17\u003c\/li\u003e\n\u003cli\u003eBase Thickness: T0.6mm and T0.35mm (dual-thickness design)\u003c\/li\u003e\n\u003cli\u003eStencil Quantity: 75 pieces\u003c\/li\u003e\n\u003cli\u003eMaterial: Black engineering plastic and metal structure for the base, stainless steel for stencils\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e1 x Magnetic Base\u003c\/li\u003e\n\u003cli\u003e75 x Templates\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"2UUL","offers":[{"title":"Default Title","offer_id":40886020407471,"sku":"6616001639A","price":1560.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001639A-1.webp?v=1785677845"},{"product_id":"amaoe-ddr5-ddr6-tin-planting-bag-reballing-stencil-kit-graphics-card-memory-chip-repair-tool-6616001594a","title":"AMAOE DDR5 \/ DDR6 Tin Planting BAG Reballing Stencil Kit Graphics Card Memory Chip Repair Tool","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003e【High-Quality Stainless Steel】Crafted from premium stainless steel, ensuring durability and long-lasting performance for professional use.\u003c\/li\u003e\n\u003cli\u003e【Precision-Engineered Design】Specifically designed for BGA170 and BGA180 video memory chips, providing accurate and efficient tin planting.\u003c\/li\u003e\n\u003cli\u003e【Enhanced Graphics Chip Repair】Ideal for professional electronics repair and modification, particularly for enhancing tin planting on graphics chips.\u003c\/li\u003e\n\u003cli\u003e【Compact and Lightweight】Designed for easy handling and portability, making it convenient for technicians to use in various repair scenarios.\u003c\/li\u003e\n\u003cli\u003e【Durable and Reusable】Built to withstand repeated use, ensuring reliable performance throughout multiple repair sessions.\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e2 x Soldering Mesh\u003c\/li\u003e\n\u003cli\u003e2 x Tin Scraping Blades\u003c\/li\u003e\n\u003cli\u003e1 x Magnetic Base\u003c\/li\u003e\n\u003cli\u003e1 x Positioning Plate\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"TVCMall","offers":[{"title":"Default Title","offer_id":40885604745391,"sku":"6616001594A","price":1130.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001594A-1.webp?v=1785679711"},{"product_id":"rf4-rf-po32-50cm-x-20cm-phone-repair-mat-silicone-pad-with-stencil-set-for-bga-soldering-6616002036a","title":"RF4 RF-PO32+ 50cm x 20cm Phone Repair Mat Silicone Pad with Stencil Set for BGA Soldering","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e【Large Work Surface】The 50×20cm enlarged mat provides a spacious working area for repairing tablets and large-screen mobile phones.\u003c\/li\u003e\n\u003cli\u003e【High-Temperature Resistant】Made of high-quality solid silicone that withstands high temperatures from hot air guns and soldering irons.\u003c\/li\u003e\n\u003cli\u003e【Anti-Slip and Scratch-Resistant】The slip-resistant and wear-resistant surface protects screens and frames from scratches while resisting flux corrosion.\u003c\/li\u003e\n\u003cli\u003e【Complete BGA Soldering Kit】Includes a universal BGA soldering stencil set for chip soldering and motherboard repair, all in one package.\u003c\/li\u003e\n\u003cli\u003e【Flexible and Easy to Clean】The mat can be rolled up for flexible storage and rinsed with water to clean solder paste residue for repeated use.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eSpecifications:\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMaterial: Silicone (Main Mat), Metal\/Steel Mesh (Templates)\u003c\/li\u003e\n\u003cli\u003eSize: 50cm x 20cm\u003c\/li\u003e\n\u003cli\u003eQuantity: 1 Silicone Mat + 10 Templates\u003c\/li\u003e\n\u003cli\u003eTemplate Models: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e1 x Repair Mat\u003c\/li\u003e\n\u003cli\u003e11 x Soldering Stencil\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"RF4","offers":[{"title":"Default Title","offer_id":40885103231151,"sku":"6616002036A","price":880.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616002036A-1.webp?v=1785681373"},{"product_id":"relife-rl-601ma-a8-a15-cpu-reballing-stencil-platform-for-iphone-6-13-pro-max-ic-chip-planting-tin-template-fixture-661600618a","title":"RELIFE RL-601MA A8-A15 CPU Reballing Stencil Platform for iPhone 6-13 Pro Max IC Chip Planting Tin Template Fixture","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eUsing a new type of magnetic power original positioning, strong magnetic automatic camping convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping\u003c\/li\u003e\n\u003cli\u003eVarious models, suitable for A8 \/ A9 \/ A10 \/ A11 \/ A12 \/ A13 \/ A14 \/ A15\u003c\/li\u003e\n\u003cli\u003eBuilt-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged\u003c\/li\u003e\n\u003cli\u003eGeneral more IC clamps such as chip CPU\/hard disk\/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil)\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecifications:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eBrand: RELIFE\u003c\/li\u003e\n\u003cli\u003eProduct: CPU Reballing Stencil Platform\u003c\/li\u003e\n\u003cli\u003eModel: RL-601MA\u003c\/li\u003e\n\u003cli\u003eNet weight: about 130g\u003c\/li\u003e\n\u003cli\u003eGross weight: 150g\u003c\/li\u003e\n\u003cli\u003eSize: 55*70*14mm\u003c\/li\u003e\n\u003cli\u003eSteel Stencil Thickness: 0.12mm\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cspan\u003e\u003cstrong\u003eNote: Manual measurement will have ± tolerance, for reference only, please refer to the actual product.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e1 x Fixture\u003c\/li\u003e\n\u003cli\u003e8 x Steel Mesh\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"RELIFE","offers":[{"title":"Default Title","offer_id":40895694143663,"sku":"661600618A","price":690.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_661600618A-1.webp?v=1785683470"},{"product_id":"maant-a8-a18-pro-12pcs-chip-cpu-bga-reballing-stencil-template-net-for-iphone-chip-repair-6616001722a","title":"MAANT A8-A18 Pro 12Pcs Chip CPU BGA Reballing Stencil Template Net for iPhone Chip Repair","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003e【Precision Laser-Cut BGA Stencils】High-precision stainless steel construction with square chamfer design (1\/4-1\/2 mil) ensures accurate solder ball placement and uniform distribution for professional BGA reballing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cpre data-spm-anchor-id=\"a2g0o.detail.0.i6.45a8kXnOkXnOc8\"\u003e【Magnetic Power Tin Planting Platform\u003cspan\u003e】\u003c\/span\u003eThe magnetic power tin planting platform provides a secure grip, simplifying the reballing process for a wide range of CPUs.\u003c\/pre\u003e\n\u003c\/li\u003e\n\u003cli\u003e【Professional-Grade Manufacturing】Constructed from medical-grade 304\/316L stainless steel with ±2μm hole precision, ensuring durability and consistent performance in professional repair environments.\u003c\/li\u003e\n\u003cli\u003e【Precision Alignment Features】Each stencil includes four corner positioning holes (Φ3.0mm) and center cross-reference marks for accurate chip-to-stencil alignment during repairs.\u003c\/li\u003e\n\u003cli\u003e【Chip-Specific Design】Each model features custom aperture patterns matching specific BGA chip layouts, preventing bridging and cold joints while ensuring optimal solder ball distribution.\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e12 x BGA Reballing Stencil Template Net\u003c\/li\u003e\u003c\/ul\u003e","brand":"MaAnt","offers":[{"title":"Default Title","offer_id":40894530355375,"sku":"6616001722A","price":580.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001722A-1.webp?v=1785686187"},{"product_id":"best-bst-082-for-iphone-13-series-cpu-soldering-reballing-stencil-cell-phone-magnetic-tinning-plate-661600826a","title":"BEST BST-082 For iPhone 13 Series CPU Soldering Reballing Stencil Cell Phone Magnetic Tinning Plate","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003eThere is a strong magnet embedded in the base, and strong magnetic adsorption, so that the positioning is accurate, does not deviate, and the magnetism does not change at high temperatures\u003c\/li\u003e\n\u003cli\u003eHigh temperature resistant, not easy to deform, non-sticky, easy to get off the net\u003c\/li\u003e\n\u003cli\u003eEvery tin dot is as full as a pearl. Suitable for iPhone 13 series motherboard mid-layer repair\u003c\/li\u003e\n\u003cli\u003eStrong magnetic adsorption for a tight fit. With precise positioning alignment holes for more convenience\u003c\/li\u003e\n\u003cli\u003eCNC high-precision integrated processing, stencil and pad precision alignment stable positioning scraping tin ball implantation without deviation\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x Set of CPU Soldering Reballing Stencil\u003c\/li\u003e\u003c\/ul\u003e","brand":"BEST","offers":[{"title":"Default Title","offer_id":40894398890159,"sku":"661600826A","price":570.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_661600826A-1.webp?v=1785686239"},{"product_id":"best-bst-ip-a8-a17-10pcs-bga-ic-solder-reballing-stencil-0-12mm-steel-template-for-iphone-6-15-series-6616001920a","title":"BEST BST-IP (A8-A17) 10Pcs BGA IC Solder Reballing Stencil 0.12mm Steel Template for iPhone 6-15 Series","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e【Professional BGA Reballing Stencil】High-precision solder reballing stencil designed specifically for BGA chip repair and tin ball replacement in professional electronics repair.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【Premium Stainless Steel】Made from high-grade stainless steel with tin plating surface treatment for superior durability and precision.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【Ultra-Thin 0.12mm Design】Precision die-casting technology creates ultra-thin 0.12mm thickness with high toughness, ensuring no warping or deformation during use.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【700℃ High Temperature Resistant】Withstands extreme temperatures up to 700℃ without thermal deformation, perfect for professional soldering applications.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【Easy Release \u0026amp; Full Solder Joints】Non-stick surface ensures easy removal from PCB boards without leaving empty solder points, achieving full and precise solder ball placement.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eSpecifications:\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMaterial: Stainless Steel\u003c\/li\u003e\n\u003cli\u003eSurface Treatment: Tin Plating\u003c\/li\u003e\n\u003cli\u003eThickness: 0.12mm\u003c\/li\u003e\n\u003cli\u003eDimensions: 100mm x 80mm\u003c\/li\u003e\n\u003cli\u003eTemperature Resistance: Up to 700℃\u003c\/li\u003e\n\u003cli\u003eChip Models: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e10 x BGA IC Solder Reballing Stencils\u003c\/li\u003e\u003c\/ul\u003e","brand":"BEST","offers":[{"title":"Default Title","offer_id":40894352523439,"sku":"6616001920A","price":560.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001920A-1.webp?v=1785686693"},{"product_id":"best-bst-sam-sam-8-17-10pcs-bga-ic-solder-reballing-stencil-kit-0-12mm-steel-repair-tools-6616001915a","title":"BEST BST-SAM (SAM: 8-17) 10Pcs BGA IC Solder Reballing Stencil Kit 0.12mm Steel Repair Tools","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cp\u003e【High-Precision BGA Reballing Stencils】Professional-grade stencils specifically designed for Samsung series chip reballing with precise hole placement and snug fit for accurate solder ball positioning.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【Premium Steel Construction】Made from high-quality Japanese stainless steel with 700℃ high-temperature resistance, ensuring durability and long service life without deformation.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【Ultra-Thin 0.12mm Design】Precision die-cast construction with 0.12mm thickness provides flexibility while maintaining structural integrity for professional IC repair work.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003e【Non-Stick Tin Plating Surface】Special tin plating treatment prevents solder adhesion and enables easy removal from circuit boards without leaving cold joints or bridges.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e【Professional Reballing Solution】Engineered for IC chip repair and rework processes, delivering high yield rates and full solder joints when properly aligned.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eSpecifications:\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMaterial: Stainless Steel\u003c\/li\u003e\n\u003cli\u003eSurface Treatment: Tin Plating\u003c\/li\u003e\n\u003cli\u003eThickness: 0.12mm\u003c\/li\u003e\n\u003cli\u003eTemperature Resistance: Up to 700℃\u003c\/li\u003e\n\u003cli\u003eStencil Dimensions: 100mm x 80mm\u003c\/li\u003e\n\u003cli\u003eManufacturing Process: Precision Die Casting\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e10 x BGA IC Solder Reballing Stencils\u003c\/li\u003e\u003c\/ul\u003e","brand":"BEST","offers":[{"title":"Default Title","offer_id":40894262706351,"sku":"6616001915A","price":550.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001915A-1.webp?v=1785686855"},{"product_id":"2uul-bh16-nand-reballing-station-magnetic-double-sided-soldering-platform-kit-for-smartphone-tablet-repair-6616001640a","title":"2UUL BH16 NAND Reballing Station Magnetic Double-Sided Soldering Platform Kit for Smartphone \/ Tablet Repair","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003e【Dual-Sided Design】The reball base features a dual-sided design, allowing technicians to process different types of NAND or BGA chips without switching platforms, significantly improving work efficiency.\u003c\/li\u003e\n\u003cli\u003e【Strong Magnetic Fixation】Built-in strong magnets securely hold chips in place, preventing movement during solder paste application or hot air heating. This magnetic stability reduces issues such as solder bridges or misalignment.\u003c\/li\u003e\n\u003cli\u003e【NAND Flash Optimized】The BH16 model is optimized for NAND flash chips, particularly suitable for BGA-type NAND chips used in smartphones and tablets.\u003c\/li\u003e\n\u003cli\u003e【Versatile Compatibility】Includes BGA110 and BGA315 stencils, making it highly compatible with common NAND heights.\u003c\/li\u003e\n\u003cli\u003e【Heat Resistant】The platform can withstand high temperatures from hot air guns and heating stations, maintaining structural integrity and durability for frequent professional use.\u003c\/li\u003e\n\u003cli\u003e【Ergonomic Design】The base features rounded edges for comfortable grip and easy operation.\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e1 x Magnetic Base\u003c\/li\u003e\n\u003cli\u003e2 x Templates\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"2UUL","offers":[{"title":"Default Title","offer_id":40893936205999,"sku":"6616001640A","price":530.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001640A-1.webp?v=1785687236"},{"product_id":"relife-rl-044-12pcs-ip-series-cpu-integrated-steel-mesh-set-iphone-6-17-series-cpu-tin-planting-kit-661600932a","title":"RELIFE RL-044 12Pcs IP Series CPU Integrated Steel Mesh Set iPhone 6-17 Series CPU Tin Planting Kit","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003e【Half-Cut Design, Precise Alignment】The real machine is measured to ensure accuracy. Each mesh is calibrated according to the original drawings to ensure that every solder joint is not missing; the special chip is half-cut and designed to block the remaining tin to meet different requirements\u003c\/li\u003e\n\u003cli\u003e【Round and Full】It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips\u003c\/li\u003e\n\u003cli\u003e【Ultra-thin and Super Tough】Ultra-thin design, better ft of tin planting, continuous bending, and full toughness\u003c\/li\u003e\n\u003cli\u003e【High Temperature and Wear Resistance】High-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance, so that each tin point is heated evenly\u003c\/li\u003e\n\u003cli\u003e【Precision Hole Pitch Design】The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x CPU Integrated Steel Mesh Set\u003c\/li\u003e\u003c\/ul\u003e","brand":"RELIFE","offers":[{"title":"Default Title","offer_id":40893778755759,"sku":"661600932A","price":520.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_661600932A-1.webp?v=1785687737"},{"product_id":"best-bst-083-middle-layer-tin-planting-platform-for-iphone-14-series-motherboard-repair-tools-661600825a","title":"BEST BST-083 Middle Layer Tin Planting Platform for iPhone 14 Series Motherboard Repair Tools","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003eCompatible with \u003ca href=\"https:\/\/www.tvc-mall.com\/ProductList\/List?keywords=Mate%20X2\" target=\"_blank\"\u003eiPhone 14\u003c\/a\u003e series\u003c\/li\u003e\n\u003cli\u003eMade of high-quality material, durable and long time to use\u003c\/li\u003e\n\u003cli\u003eTin planting in the middle layer makes the positioning point more accurate\u003c\/li\u003e\n\u003cli\u003eSubvert the traditional new method of tin planting\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x Middle Layer Tin Planting Platform\u003c\/li\u003e\u003c\/ul\u003e","brand":"BEST","offers":[{"title":"Default Title","offer_id":40891637792943,"sku":"661600825A","price":410.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_661600825A-1.webp?v=1785692145"},{"product_id":"relife-rl-044-lcd-screen-original-color-face-ic-planting-tin-network-mesh-for-iphone-6s-13-pro-max-661600534a","title":"RELIFE RL-044 LCD Screen\/Original Color\/Face IC Planting Tin Network Mesh for iPhone 6S - 13 Pro Max","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eLCD screen planting tin comprehensive network, suitable for iPhone 6S - 13 Pro Max LCD screen\/original color\/face IC planting tin, etc.\u003c\/li\u003e\n\u003cli\u003eThese stencils were made from high-quality steel material, anti-swell, heat-resistant and scratch-resistant, can be heated directly by a hot air gun\u003c\/li\u003e\n\u003cli\u003eSuper flexible and tough with good flatness, not easy to deform, with the normal bend it can be restored easily\u003c\/li\u003e\n\u003cli\u003ePrecise hole position of real machine measurements, with Cooling hole design, restore every soldering ball present on the initial drawing\u003c\/li\u003e\n\u003cli\u003eThe round-square hole makes the net more durable, it is easy and quickly for reballing and taking out, prevents the tin ball from getting stuck in the mesh\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cspan\u003e\u003cstrong\u003eNote: The soldering process is complicated, so we highly recommend a professional to replace\/solder, novices need the guidance of a professional.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\n\u003cli\u003e1 x Planting Tin Network Mesh\u003c\/li\u003e\n\u003cli\u003eOther items not included\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"RELIFE","offers":[{"title":"Default Title","offer_id":40899001974959,"sku":"661600534A","price":230.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_661600534A-1.webp?v=1785723409"},{"product_id":"amaoe-emmc3-bga-reballing-stencil-emcp-emmc-memory-flash-ic-reball-solder-tin-plant-net-steel-mesh-weld-heat-6616001595a","title":"AMAOE EMMC3 BGA Reballing Stencil EMCP EMMC Memory Flash IC Reball Solder Tin Plant Net Steel Mesh Weld Heat","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003e【Versatile Compatibility】Designed for EMMC3 BGA, compatible with various models including BGA162, 153, 169, 221, 186, 254, EMCP, and EMMC Memory Flash IC.\u003c\/li\u003e\n\u003cli\u003e【Precision Reball Tool】Specialized steel mesh for accurate solder tin planting in BGA rework and repair processes.\u003c\/li\u003e\n\u003cli\u003e【Professional Grade】High-quality stencil for EMMC3 chip reballing, ensuring precise solder application.\u003c\/li\u003e\n\u003cli\u003e【Heat Resistant】Engineered to withstand high temperatures during the soldering process, maintaining shape and accuracy.\u003c\/li\u003e\n\u003cli\u003e【Easy to Use】Facilitates efficient and reliable reballing for both professional technicians and DIY enthusiasts.\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x BGA Reballing Stencil\u003c\/li\u003e\u003c\/ul\u003e","brand":"TVCMall","offers":[{"title":"Default Title","offer_id":40898887155887,"sku":"6616001595A","price":230.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001595A-1.webp?v=1785723734"},{"product_id":"amaoe-u-ip12-0-12mm-cpu-planting-tin-mesh-for-iphone-16-16-plus-16-pro-16-pro-max-6616001501a","title":"AMAOE U-IP12 0.12MM CPU Planting Tin Mesh For iPhone 16  \/  16 Plus  \/  16 Pro  \/  16 Pro Max","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e【Precision Crafted】The U-IP12 0.12MM CPU reballing stencil is specifically designed for the iPhone 16 series, ensuring precise and accurate repairs.\u003c\/li\u003e\n\u003cli\u003e【Ultra-Thin Design】At just 0.12MM thickness, this stencil allows for precise solder application, minimizing the risk of damage to delicate components.\u003c\/li\u003e\n\u003cli\u003e【Professional Grade】Engineered for use by repair technicians, this tool facilitates efficient and reliable CPU reballing processes.\u003c\/li\u003e\n\u003cli\u003e【Compatible with iPhone 16 Series】Specifically tailored for use with the latest iPhone 16 \/ 16 plus \/ 16 pro \/ 16 pro max models, ensuring a perfect fit and optimal results.\u003c\/li\u003e\n\u003cli\u003e【Essential Repair Tool】An indispensable accessory for mobile phone repair shops and technicians specializing in iPhone repairs.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecifications:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eModel: U-IP12\u003c\/li\u003e\n\u003cli\u003eThickness: 0.12MM\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x CPU Planting Tin Mesh\u003c\/li\u003e\u003c\/ul\u003e","brand":"TVCMall","offers":[{"title":"Default Title","offer_id":40889207947439,"sku":"6616001501A","price":210.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_6616001501A-1.webp?v=1785728170"},{"product_id":"amaoe-for-iphone-17-series-face-id-solder-stencil-0-12mm-bga-repair-precision-laser-etched-steel-mesh-6616001694a","title":"AMAOE For iPhone 17 Series Face ID Solder Stencil 0.12MM BGA Repair Precision Laser Etched Steel Mesh","description":"\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003e【Precision Laser-Etched Steel Stencil】High-precision laser etching technology ensures accurate solder paste printing positioning for reliable chip reballing operations.\u003c\/li\u003e\n\u003cli\u003e【Specialized Design for iPhone 17 Series】Specifically engineered for iPhone 17 series Face ID module repair, supporting both small board and flex cable reballing processes.\u003c\/li\u003e\n\u003cli\u003e【Dual Layout Configuration】Features distinct \"Small Board Reballing\" and \"Flex Cable Reballing\" opening layouts to accommodate different repair scenarios and component types.\u003c\/li\u003e\n\u003cli\u003e【Professional Grade Thickness】0.12mm face thickness provides optimal solder paste volume control for precise BGA\/QFN package chip reballing applications.\u003c\/li\u003e\n\u003cli\u003e【High-Precision Repair Support】Dotted line contour openings ensure accurate alignment and easy demolding for professional-grade repair operations.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecifications:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eMaterial: Stainless Steel\u003c\/li\u003e\n\u003cli\u003eFace Thickness: 0.12mm\u003c\/li\u003e\n\u003cli\u003eApplication: BGA\/QFN chip reballing\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x Face ID Tin Planting 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or BGA rework reballing\u003c\/p\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X\/8P\/8-A11\u003c\/li\u003e\u003c\/ul\u003e","brand":"TVCMall","offers":[{"title":"Default Title","offer_id":40887561060527,"sku":"090602550A","price":190.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_090602550A-1.webp?v=1785732660"},{"product_id":"bst-iph-2-ic-chip-bga-reballing-stencil-solder-template-for-iphone-6s-6sp-a9-090602552a","title":"BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S\/6SP-A9","description":"\u003cdiv\u003e\u003cul class=\" list-paddingleft-2\"\u003e\n\u003cli\u003e\u003cp\u003eMade by high quality metal material\u003c\/p\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cp\u003eEasy and quickly for reballing the BGA IC\u003c\/p\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cp\u003eExcellent to replace IC or BGA rework reballing\u003c\/p\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003c\/div\u003e\n\u003ch4\u003eIn the box\u003c\/h4\u003e\u003cul\u003e\u003cli\u003e1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S\/6SP-A9\u003c\/li\u003e\u003c\/ul\u003e","brand":"TVCMall","offers":[{"title":"Default Title","offer_id":40887560929455,"sku":"090602552A","price":190.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_090602552A-1.webp?v=1785732660"},{"product_id":"amaoe-green-oil-uv-stencil-for-iphone-air-16-15-14-13-12-11-xs-pcb-ic-chip-bga-reballing-6616001662a","title":"AMAOE Green Oil UV Stencil for iPhone Air \/ 16 \/ 15 \/ 14 \/ 13 \/ 12 \/ 11 \/ XS PCB IC Chip BGA Reballing","description":"\u003cdiv\u003e\u003cul\u003e\n\u003cli\u003e【Precision Protection】UV-curable green solder resist film designed for PCB and 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Individual patterns can be cut and applied to solder pads, then cured with UV light for precise protection against soldering errors.\u003c\/li\u003e\n\u003cli\u003e【Versatile Compatibility】Compatible with a wide range for iPhone models, including for iPhone Air\/16\/15\/14\/13\/12\/11\/XS. The film is divided into CPU and PCB sections to accommodate different device layouts.\u003c\/li\u003e\n\u003cli\u003e【Easy Application】Features a grid-like thin film structure that can be easily cut to fit specific patterns. 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mini\u003c\/li\u003e\u003c\/ul\u003e","brand":"TVCMall","offers":[{"title":"Default Title","offer_id":41899257954479,"sku":"090602547A","price":170.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/2523\/5770\/files\/1000x1000_090602547A-1.webp?v=1785735910"},{"product_id":"oem-bst-iph-10-tin-planting-net-for-ipad-pro-9-7-12-9-2015-090602536a","title":"OEM BST-iPH-10 Tin Planting Net for iPad Pro 9.7 \/ 12.9 (2015)","description":"\u003cdiv\u003e\n\u003cul class=\" list-paddingleft-2\"\u003e\n\u003cli\u003e\u003cp\u003eExquisite casting pricess\u003c\/p\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cp\u003eAccurate reballing stencil \u003c\/p\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cp\u003eNeat and tidy tin point\u003c\/p\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecifications: \u003c\/strong\u003e\u003c\/p\u003e\n\u003cul class=\" list-paddingleft-2\"\u003e\n\u003cli\u003e\u003cp\u003eModel: 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